| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent sensitivity and resolution of a resist pattern after development, generating little scum in a developing stage, having excellent contrast after exposure, forming peeled pieces having small sizes, giving a cured film having excellent softness and useful as a DFR for the preparation of a substrate for an alkali-developing printed circuit board, a lead frame and a semiconductor package. <P>SOLUTION: The photosensitive resin composition contains (a) 20-90 mass% binder resin composed of a linear polymer having a carboxy group content of 100-600 in terms of an acid equivalent and a weight-average molecular weight of 20,000-500,000, (b) 5-75 mass% photopolymerizable monomer having at least one terminal ethylenic unsaturated group and (c) 0.01-30 mass% photopolymerization initiator containing a specific compound. <P>COPYRIGHT: (C)2008,JPO&INPIT |
