| 摘要 |
PROBLEM TO BE SOLVED: To prevent a surplus solder, protruding from a heat dissipation metal pattern, from coming into contact with a terminal, a land or the like to cause short circuit.SOLUTION: In a mounting structure of an electronic component, the terminal 2 of an electronic component package 1 is solder joined by reflow system while being superposed on the land 4 of an electronic substrate 3, and a chip heat dissipation member 5, provided on the bottom surface of the electronic component package 1, is solder joined by reflow system while being superposed on the heat dissipation metal pattern 6 of the electronic substrate 3. The chip heat dissipation member 5 is formed with a size being surrounded on all sides by a package resin constituting the electronic component package 1. The heat dissipation metal pattern 6 integrally has a pattern extension 22, at least a portion of which extends to protrude from the electronic component package 1 continuously to the heat dissipation metal pattern 6, so as to be larger than the electronic component package 1, and leads a surplus solder 21 to the outside of the electronic component package 1.SELECTED DRAWING: Figure 1 |
