Chip inductor

摘要

Disclosed herein is a chip inductor. The chip inductor according to the present invention includes a substrate on which a through-hole is formed, a conductive coil that is formed on the substrate, an upper resin composite magnetic layer that is filled to surround the conductive coil so that a core is formed on a center portion of the substrate, a lower resin composite magnetic layer that is formed on a bottom portion of the substrate, and an external electrode that is formed on both sides of the upper and lower resin composite magnetic layers.

主权项

1. A chip inductor, comprising:
a substrate on which a through-hole is formed; a conductive coil that is formed on an upper surface of the substrate and laminated in a plurality of layers; an upper resin composite magnetic layer that is filled to surround the conductive coil so that a core is formed in a center portion of the Upper resin composite magnetic layer formed on the upper side of the substrate; a lower resin composite magnetic layer that is formed on a bottom portion of the substrate; and an external electrode that is formed on both sides of the upper and lower resin composite magnetic layers, wherein an insulating layer is formed surrounding an outer peripheral surface of the conductive coil, and wherein the conductive coil is extended in two symmetrical directions of both sides of quadrants of the substrate to thereby be electrically connected with the external electrode.