| 摘要 |
<p>A ceramic heater, wherein a resistance heating element is formed on the surface of or inside a ceramic substrate and a through-hole is provided in the ceramic substrate, characterized in that the surface roughness of the wall surface of the through-hole in accordance with JIS B0601 is Rmax=0.05 to 200 µm, whereby the heater allowing the heating surface thereof to be heated uniformly without allowing the temperature around the through-hole to be lowered even when the through-hole allowing a lifter pin for supporting a semiconductor wafer to be inserted therein is formed.</p> |
