| 摘要 |
An endoscope 2 in which an imaging device 1 is disposed at a distal-end part 2a of an insertion part, the imaging device 1 being provided with: an imaging element 10 having a semiconductor substrate 11 having a junction terminal 18 on a second principal face 10SB and in which an imaging part 13 is formed on a first principal face 10SA, and a wiring layer 12 disposed on the first principal face 10SA of the semiconductor substrate 11 and in which a conductor layer 12A is layered via insulating layers 12B, 12C; and a cover glass 30 bonded so as to cover the entire first principal face side of the imaging element 10; wherein the endoscope 2 has a protective part 40 in which shielding particles 42 having lower moisture permeability than a resin 41 are dispersed in the resin 41 so as to cover at least a lateral face of the wiring layer 12 of the imaging element 10. |
