| 摘要 |
PROBLEM TO BE SOLVED: To provide an art capable of inhibiting grinding of a metallic component composed of an oxygen-free copper.SOLUTION: A semiconductor device 1 comprises: a semiconductor element 10; a first metallic component 21 composed of an oxygen-free copper which is fixed to an under surface 102 of the semiconductor element 10; a first coating member 51 which coats a part of an under surface 212 of the first metallic component 21 on the side opposite to the side fixed to the semiconductor element 10; an encapsulation resin 30 which encapsulates the semiconductor element 10 and the first metallic component 21 so as to expose an under surface 512 of the first coating member 51 on the side opposite to the side fixed to the first metallic component 21 and the under surface 212 of the first metallic component 21, which is not coated with the first coating member 51; and a first insulation member 71 connected via a grease 60 to the under surface 512 of the first coating member 51 and the under surface 212 of the first metallic component 21, which are exposed from the encapsulation resin 30. The first coating member 51 is formed by a material having a linear expansion coefficient smaller than that of the oxygen-free copper.SELECTED DRAWING: Figure 1 |
