发明名称 METHOD FOR FORMING SPACERS FOR A TRANSISTOR GATE
摘要 A method is provided for forming spacers for a gate of a field effect transistor, the gate being situated above a layer of semiconductor material, including forming a layer of nitride covering the gate; modifying the layer by plasma implantation of light ions, having an atomic number equal or less than 10, in the layer in order to form a modified layer of nitride, the modifying being performed so as not to modify the layer of nitride over its entire thickness at flanks of the gate; and removing the modified layer of nitride by a selective wet or dry etching, of the modified layer relative to said layer of semiconductor material and relative to the non-modified layer at the flanks of the gate, without etching the layer of semiconductor material, wherein an entire length of the non-modified layer at the flanks remains after the selective wet or dry etching.
申请公布号 US2016300709(A1) 申请公布日期 2016.10.13
申请号 US201615091916 申请日期 2016.04.06
申请人 COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES ;CNRS Centre National de la Recherche Scientifique ;APPLIED MATERIALS, Inc. 发明人 POSSEME Nicolas;David Thibaut;Joubert Olivier;Lill Thorsten;Nemani Srinivas;Vallier Laurent
分类号 H01L21/02;H01L21/265;H01L21/3065;H01L21/306 主分类号 H01L21/02
代理机构 代理人
主权项 1. A method for forming spacers for a gate of a field effect transistor, the gate being situated above a layer of semiconductor material, comprising: forming a layer of nitride covering the gate; modifying the layer of nitride by plasma implantation of light ions, having an atomic number equal or less than 10, in the layer of nitride in order to form a modified layer of nitride, the modifying being performed so as not to modify the layer of nitride over its entire thickness at flanks of the gate; and removing the modified layer of nitride by a selective wet etching, or a selective dry etching, of the modified layer of nitride relative to said layer of semiconductor material and relative to the non-modified layer of nitride at the flanks of the gate, without etching the layer of semiconductor material, wherein an entire length of the non-modified layer of nitride at the flanks of the gate remains after the selective wet etching, or after the selective dry etching.
地址 Paris FR