| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing method capable of stably holding a wafer while maintaining a gap between chips and easily transporting the wafer to a next step without damaging a chip.SOLUTION: A wafer processing method comprises: a modified layer formation step; a grinding step; an adhesive tape sticking step; a tape expanding step; a second annular frame sticking step; and an expand tape peeling step. The modified layer formation step forms a modified layer K on a wafer W. The grinding step divides the wafer W by grinding operation with the modified layer K as a starting point. The adhesive tape sticking step sticks DAF100 to a rear surface WR of the wafer W. The tape expanding step increases a gap G between chips DT by pressing an expand tape T1 to which the wafer W is stuck. The second annular frame sticking step sticks an adhesive tape T2 to the expanded and ruptured wafer W and DAF100. The expand tape peeling step peels the expand tape T1 from a surface WS of the wafer W. |
