发明名称 ETCHING METHOD
摘要 An etching method is described, including a first etching step that uses a first etching gas including a first fluorinated hydrocarbon compound, and a second etching step that uses a second etching gas including a second fluorinated hydrocarbon compound. The hydrogen content in the first fluorinated hydrocarbon compound is lower than that in the second fluorinated hydrocarbon compound, such that the after-etching-inspection (AEI) critical dimension is smaller than the after-development-inspection (ADI) critical dimension.
申请公布号 US2008090422(A1) 申请公布日期 2008.04.17
申请号 US20070954214 申请日期 2007.12.12
申请人 UNITED MICROELECTRONICS CORP. 发明人 CHOU PEI-YU;LIAO JIUNN-HSIUNG
分类号 H01L21/311 主分类号 H01L21/311
代理机构 代理人
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