SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To reduce heat resistance from an element surface of a semiconductor chip to a surface of a semiconductor package; and achieve easy division patterning of metal and considerably reduce stress generated due to a difference in thermal expansion coefficients of silicon and metal to improve environmental reliability; and achieve low cost by manufacturing a semiconductor package without using a TIM material.SOLUTION: A semiconductor package includes: a semiconductor chip which has an element surface where electrodes are arranged and a rear face opposite to the element surface and which is covered with resin; first wiring connected directly with the electrodes or via first openings arranged on the resin; and second wiring connected to the rear face via second openings arranged on the resin.SELECTED DRAWING: Figure 12