发明名称 Wärmeempfindlicher Klebstoff, gefügter Gegenstand, Verfahren und Vorrichtung zur Wärmeaktivierung des wärmeempfindlichen Klebstoffs
摘要 <p>A heat-sensitive adhesive material contains a substrate and a heat-sensitive adhesive layer that contains a thermoplastic resin and a solid plasticizer, and the heat-sensitive adhesive material is so configured as to be heated and applied to an adherend, wherein the heat-sensitive adhesive material exhibits such an adhesive strength to the adherend as to increase with time from immediately after applying the heat-sensitive adhesive material to the adherend.</p>
申请公布号 DE602004007579(D1) 申请公布日期 2007.08.30
申请号 DE20046007579T 申请日期 2004.05.21
申请人 RICOH CO. LTD. 发明人 MORITA, MITSUNOBU;KUGO, TOMOYUKI;GOTO, HIROSHI;INABA, NORIHIKO
分类号 C09J7/02;C08K5/00;C08K5/3475;C09J11/06 主分类号 C09J7/02
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