发明名称 |
Wärmeempfindlicher Klebstoff, gefügter Gegenstand, Verfahren und Vorrichtung zur Wärmeaktivierung des wärmeempfindlichen Klebstoffs |
摘要 |
<p>A heat-sensitive adhesive material contains a substrate and a heat-sensitive adhesive layer that contains a thermoplastic resin and a solid plasticizer, and the heat-sensitive adhesive material is so configured as to be heated and applied to an adherend, wherein the heat-sensitive adhesive material exhibits such an adhesive strength to the adherend as to increase with time from immediately after applying the heat-sensitive adhesive material to the adherend.</p> |
申请公布号 |
DE602004007579(D1) |
申请公布日期 |
2007.08.30 |
申请号 |
DE20046007579T |
申请日期 |
2004.05.21 |
申请人 |
RICOH CO. LTD. |
发明人 |
MORITA, MITSUNOBU;KUGO, TOMOYUKI;GOTO, HIROSHI;INABA, NORIHIKO |
分类号 |
C09J7/02;C08K5/00;C08K5/3475;C09J11/06 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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