| 摘要 |
The invention relates to a light-emitting diode (100) comprising an optoelectronic semiconductor chip (1) having a radiation side (16), a contact side (12) opposite the radiation side (16) and side surfaces (15) extending transversely with respect to the radiation side (16). A first contact element (10) for external electrical contacting of the semiconductor chip (1) is arranged on the contact side (12). The light-emitting diode (100) further comprises a transparent solid body (2) and a covering element (3). In the intended operational use, the semiconductor chip (1) emits electromagnetic radiation over the radiation side (16) along a main emission direction (17) extending transversely with respect to the radiation side (16). The semiconductor chip (1) is embedded in the solid body (2), wherein the solid body (2) positively covers the side surfaces (15) and the radiation side (16). The solid body (2) widens along the main emission direction (17). The covering element (3) is arranged downstream of the solid body (2) in the main emission direction (17) and is arranged directly on the solid body (2). A side of the covering element (3) facing away from the solid body (2) is designed as a radiation exit surface (30) of the light-emitting diode (100). The first contact element (10) is exposed in the unmounted and/or non-contacted state of the light-emitting diode (100). |
