| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing apparatus capable of polishing a substrate while keeping a distance between the substrate and a polishing surface constant even when the polishing surface formed by a polishing pad or the like is worn out due to polishing. <P>SOLUTION: The polishing apparatus includes a retainer ring 302 that is a top ring 20 used for the polishing apparatus that polishes the substrate by pressing the substrate to a polishing surface of a polishing table while retaining the substrate, and retains an outer peripheral edge of the substrate during polishing of the substrate. The retainer ring 302 has a ring member 408 that is brought in contact with a polishing surface by moving in the vertical direction corresponding to movement of an elastic membrane 404 that is deformed in a vertical direction by fluid supplied to a chamber 410 formed in the inner part. <P>COPYRIGHT: (C)2009,JPO&INPIT |
