发明名称 |
MOLDING OF PROTECTIVE CAPS |
摘要 |
<p>The invention is a method of forming an array of caps for attachment to a wafer which includes a plurality of microfabricated devices. The method includes sandwiching a sheet (134) of thermoplastic material between upper and lower molds (102, 104), heating the sheet to a plastic state and molding the sheet into caps. The molds (102, 104) are preferably formed of silicon and infrared radiation is preferably used to heat the sheet (134).</p> |
申请公布号 |
WO02056375(A1) |
申请公布日期 |
2002.07.18 |
申请号 |
WO2002AU00009 |
申请日期 |
2002.01.08 |
申请人 |
SILVERBROOK RESEARCH PTY. LTD.;SILVERBROOK, KIA |
发明人 |
SILVERBROOK, KIA |
分类号 |
B29C51/08;B29C35/08;B29C43/18;B29C43/36;B29C43/50;B29L31/56;B81B7/00;B81C1/00;H01L21/48;H01L21/50;H01L23/02;H01L23/08;(IPC1-7):H01L23/28;B29C43/04 |
主分类号 |
B29C51/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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