| 摘要 |
<P>PROBLEM TO BE SOLVED: To ensure an electrical insulating property between a reflection board and a wiring board, and to easily align the reflection board and the wiring board in an isolation type light-emitting diode package. <P>SOLUTION: The light-emitting diode package has a wiring layer, the reflection board and light-emitting diode elements, and an insulating layer is formed between the wiring board and the reflection board. Through-holes for arranging the light-emitting diode elements are formed on the reflection board, and openings for arranging the light-emitting diode elements are formed on the insulating layer. The openings of the insulating layer are smaller than the through-holes of the reflection board, and the insulating layer is exposed from the through-holes of the reflection board. <P>COPYRIGHT: (C)2008,JPO&INPIT |
