发明名称 |
CIRCUIT BOARD LAMINATE, METAL BASE CIRCUIT BOARD, AND POWER MODULE |
摘要 |
PROBLEM TO BE SOLVED: To provide: a circuit board laminate that is excellent in heat resistance, durability and solder connection reliability and has long-term reliability; a metal base circuit board; and a power module.SOLUTION: A circuit board laminate includes a metal substrate 2, an insulating layer 3 disposed on at least one surface of the metal substrate 2 and a metal foil 4 disposed on the insulating layer 3. The insulating layer 3 contains: a crosslinked copolymer of a bisphenol cyanate resin and a novolac cyanate resin; and an inorganic filler.SELECTED DRAWING: Figure 2 |
申请公布号 |
JP2016106395(A) |
申请公布日期 |
2016.06.16 |
申请号 |
JP20150239480 |
申请日期 |
2015.12.08 |
申请人 |
NHK SPRING CO LTD |
发明人 |
MIZUNO KATSUMI;MOTOI KAZUHIKO;NATSUME YUTAKA |
分类号 |
H05K1/05;B32B15/08;B32B27/00;B32B27/20;C08K3/22;C08K3/28;C08K3/38;C08K5/55;C08K9/00;C08K13/06;C08L79/04;H01L23/12;H01L23/14;H01L25/07;H01L25/18 |
主分类号 |
H05K1/05 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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