| 摘要 |
Disclosed is a solder join in which the occurrence of cracking is suppressed. A joint is produced from a solder alloy comprising 0.01 to 7.6 wt% of Cu and 0.001 to 6 wt% of Ni, with the remainder being Sn. The alloy allows the maximum ranges of the Cu content and the Ni content. The lower limit of the Ni content is 0.01 wt%, more preferably 0.03 wt%. The upper limit of the Ni content is 0.3 wt%, more preferably 0.1 wt%. The lower limit of the Cu content is 0.1 wt%, more preferably 0.2 wt%. The upper limit of the Cu content is 7 wt%, more preferably 0.92 wt%. Also disclosed is a solder joint having the above-mentioned chemical composition. |
