发明名称 |
System and method for RF shielding of a semiconductor package |
摘要 |
A semiconductor device has a substrate having a plurality of metal traces. At least one electronic component is electrically coupled to a first surface of the substrate. A mold compound is used for encapsulating portions of the electronic component and the first surface of the substrate, wherein a portion of the mold compound is removed around at least one side of the electronic component. A conductive coating is applied to the mold compound and an area where the portion of the mold compound is removed.
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申请公布号 |
US8093691(B1) |
申请公布日期 |
2012.01.10 |
申请号 |
US20090502409 |
申请日期 |
2009.07.14 |
申请人 |
FUENTES RUBEN;SCANLAN CHRISTOPHER;CHUN JONG;AMKOR TECHNOLOGY, INC. |
发明人 |
FUENTES RUBEN;SCANLAN CHRISTOPHER;CHUN JONG |
分类号 |
H01L23/552;H01L23/28;H01L23/48;H01L23/52 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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