发明名称 IMPEDANCE BOND
摘要 PROBLEM TO BE SOLVED: To provide an impedance bond which stably holds an interior member even when the size of the interior member is increased.SOLUTION: An impedance bond 1 includes: an interior member 2 including an iron core 21 and a coil 22 wound around the iron core 21; a case body 3 housing the interior member 2 and having an opening at an upper part; and a holding member 5 which is fixedly attached to the case body 3 from above and holds the interior member 2 stored in the case body 3 at a predetermined position.SELECTED DRAWING: Figure 3
申请公布号 JP2016149423(A) 申请公布日期 2016.08.18
申请号 JP20150025059 申请日期 2015.02.12
申请人 NIPPON SIGNAL CO LTD:THE 发明人 CHO TSUYOSHI
分类号 H01F30/00;B61L1/18;H01F27/26 主分类号 H01F30/00
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