发明名称 INTEGRATED CIRCUIT ARRAY AND METHOD FOR MANUFACTURING AN ARRAY OF INTEGRATED CIRCUITS
摘要 An integrated circuit array, in particular for two dimensional sensor arrays such as ultrasound imaging systems is disclosed. The integrated circuit array (10) comprises a plurality of integrated circuit elements (12) each formed in a substrate (14), wherein the substrates are separated from each other. The array comprises a flexible and/or stretchable connection layer (22) connected to the integrated circuit elements for flexibly connecting the integrated circuit elements to each other. The array further comprises a plurality of electrical interconnects (18) for electrically connecting the integrated circuit elements to each other, wherein the electrical interconnects are formed as metal lines in one piece with integrated interconnects of the integrated circuit elements.
申请公布号 US2016256133(A1) 申请公布日期 2016.09.08
申请号 US201415035779 申请日期 2014.10.16
申请人 KONINKLIJKE PHILIPS N.V. 发明人 Dekker Ronald;Henneken Vincent Adrianus;Savov Angel Metodiev
分类号 A61B8/00;H01L25/04;A61B8/12;H01L23/538 主分类号 A61B8/00
代理机构 代理人
主权项 1. An integrated circuit array for ultrasound imaging systems, comprising: a plurality of integrated circuit elements and a plurality of integrated metal lines, wherein each circuit element and the plurality of metal lines are formed in a substrate portion, wherein the substrate portions are separated from each other, a flexible and/or stretchable connection layer coupled to the integrated circuit elements configured for flexibly connecting the integrated circuit elements to each other, and a plurality of electrical interconnects for electrically coupling the integrated circuit elements. wherein each circuit element formed in a separate substrate portion, to each other, wherein the electrical interconnects are formed as the metal lines in one piece with integrated interconnects of the integrated circuit elements.
地址 Eindhoven NL