发明名称 |
LASER CUTTING OF DISPLAY GLASS COMPOSITIONS |
摘要 |
The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >1 m/sec, to cut sharp radii outer corners (<1 mm), and to create arbitrary curved shapes including forming interior holes and slots. A method of laser processing an alkaline earth boro-aluminosilicate glass composite workpiece includes focusing a pulsed laser beam into a focal line. The focal line is directed into the glass composite workpiece, generating induced absorption within the material. The workpiece and the laser beam are translated relative to each other to form a plurality of defect lines along a contour, with adjacent defect lines have a spacing of 0.1-20 microns. |
申请公布号 |
SG11201604869P(A) |
申请公布日期 |
2016.07.28 |
申请号 |
SG11201604869P |
申请日期 |
2014.12.16 |
申请人 |
CORNING INCORPORATED |
发明人 |
MARJANOVIC, SASHA;NIEBER, ALBERT ROTH;PIECH, GARRETT ANDREW;SCHILLINGER, HELMUT;TSUDA, SERGIO;WAGNER, ROBERT STEPHEN |
分类号 |
C03B33/02;B23K26/00;B23K26/06;B23K26/40;C03B25/087;C03B29/10;C03B33/07;C03B33/09 |
主分类号 |
C03B33/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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