| 摘要 |
There is provided an electronic component mounting machine in which it is possible to appropriately manage a film thickness of a fluid film which a transfer device forms using a viscous fluid, and it is possible to decrease the size of the device and to simplify the structure of the device, thus enabling a reduction in manufacturing costs. The electronic component mounting machine is provided with a film thickness gage 131 capable of being exchanged with a suction nozzle of a mounting head. The film thickness gage 131 is provided with measurement sections 136A to 136D which are formed at lengths in an axial direction corresponding to measurement values of a film thickness T of a flux film F of a storage section 64. The mounting head moves to a position above the storage section 64 and lowers the film thickness gage 131 to cause the film thickness gage 131 to come into contact with the flux film F. In the film thickness gage 131, the measurement sections 136A to 136D form measurement marks 200A to 200D corresponding to the film thickness T in the flux film F. The electronic component mounting machine images the measurement marks 200A to 200D using a mark camera 37, and determines the film thickness T of the flux film F which is actually formed based on imaging data. |
