| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a contact member ensuring good conductive connection between an electronic component and a mother board even when the electronic component is shrunk, and to provide its fabrication process. <P>SOLUTION: Resilient arms 5b, 6b, 7b of contacts 5, 6, 7 can be deformed easily and surely utilizing internal stress. The resilient arm of the contact can be deformed easily and surely utilizing internal stress even if the contact is shrunk in accordance with shrinkage of an electronic component 2. Since the resilient arm deforms resiliently and appropriately and a plurality of stacked resilient arms can function as a resilient contact, distortion caused by difference in thermal expansion coefficient between the electronic component and the mother board 1 can be absorbed appropriately by the contact, and conductive connection between the electronic component 2 and the mother board can be ensured even if a plurality of resilient contacts cause a slight positional shift of the electronic component. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
