发明名称 |
Open Cavity Plastic Package |
摘要 |
A method for manufacturing open cavity integrated circuit packages, the method comprising: placing a wire-bound integrated circuit in a mold; forcing a pin to contact a die of the wire-bound integrated circuit by applying a force between the pin and the mold; injecting plastic into the mold; allowing the plastic to set around the integrated circuit to form a package having an open cavity defined by the pin; and removing the open cavity integrated circuit package from the mold. A mold for forming a package for an integrated circuit sensor device, comprising: a bottom part for supporting an integrated circuit die; a top part that is operable to be placed on top of said bottom part to form a cavity into which a plastic material can be injected to form the package, wherein the top part of the mold comprises a spring-loaded pin arrangement comprising a cover that covers a sensor area on the integrated circuit die and provides for an opening when the plastic material is injected. |
申请公布号 |
US2016167273(A1) |
申请公布日期 |
2016.06.16 |
申请号 |
US201615050438 |
申请日期 |
2016.02.22 |
申请人 |
Microchip Technology Incorporated |
发明人 |
Fernandez Joseph D.;Kittiphinijnanta Sombat;Yamputchong Nutthiwut;Lertruttanaprecha Surachai;Maikuthavorn Viwat |
分类号 |
B29C45/26;B81B7/00 |
主分类号 |
B29C45/26 |
代理机构 |
|
代理人 |
|
主权项 |
1. A mold for forming a package for an integrated circuit sensor device, comprising
a bottom part for supporting an integrated circuit die; a top part that is operable to be placed on top of said bottom part to form a cavity into which a plastic material can be injected to form the package, wherein the top part of the mold comprises a spring-loaded pin arrangement comprising a pin extending from a cylindrical cover and being guided within a spring housing wherein the pin can be vertically moved against a spring force, wherein the cylindrical cover has a conical recess that is operable to covers a sensor area on the integrated circuit die and wherein the top part provides for an opening through which the plastic material can be injected. |
地址 |
Chandler AZ US |