发明名称 RESIN COMPOSITION AND ARTICLE COMPRISING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a resin composition which suppresses molding failure and peeling and has high surface hardness, and to provide an article comprising the resin composition.SOLUTION: A resin composition (10) includes a phase separation structure (1) having a first resin phase (2) which is formed of a first resin and a second resin phase (3) which is different from the first resin phase and is formed of a second resin. The resin composition further includes an inorganic filler (4) unevenly distributed in the first resin phase. The phase separation structure has, on its surface, a hardened layer (5) formed of the first resin phase and the inorganic filler.SELECTED DRAWING: Figure 1
申请公布号 JP2016113607(A) 申请公布日期 2016.06.23
申请号 JP20150190839 申请日期 2015.09.29
申请人 PANASONIC IP MANAGEMENT CORP 发明人 KOTANI TOMOKI
分类号 C08J5/00;B32B27/20;C08K3/00;C08K3/22;C08K3/26;C08K3/36;C08L101/00 主分类号 C08J5/00
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