METHOD OF ATTACHING A LIGHT EMITTING DEVICE TO A SUPPORT SUBSTRATE

摘要

A method according to embodiments of the invention includes providing a wafer of semiconductor light emitting devices, each semiconductor light emitting device including a light emitting layer sandwiched between an n-type region and a p-type region. A wafer of support substrates is provided, each support substrate including a body. The wafer of semiconductor light emitting devices is bonded to the wafer of support substrates. Vias are formed extending through the entire thickness of the body of each support substrate.

主权项

1. A device comprising:
a semiconductor light emitting device comprising:
a light emitting layer sandwiched between an n-type region and a p-type region;an n-contact disposed on the n-type region, wherein the n-contact is set back from an edge of the n-type region; anda reflective dielectric layer disposed on said edge of the n-type region; a support substrate comprising a body, wherein a width of the support substrate is the same as a width of the semiconductor light emitting device; and a plurality of vias formed in the body.