Electronic module with power components and manufacturing method

摘要

The module has a metal substrate with two faces. A printed circuit card is mounted on a substrate face. The card includes components mounted on the card and interconnections, such as connection tracks and conductive bridges. The mounted components include power components. There are interconnections between the power components themselves, and between the components and external devices. The shape of the conductive bridges is such that they can extend over a responsive one of the power components and mutually interconnecting short segments of the tracks, which carry power current. AN Independent claim is included for a method of manufacturing a power electronics module.