| 摘要 |
PURPOSE: A wafer cooling chamber is provided to shorten a total cooling time of the wafer and improve a cooling efficiency by forming a cooling line between a cooldown pedestal plate and a bellows assembly. CONSTITUTION: The cooling chamber(40) comprises a cooldown pedestal plate(42), a bellows assembly(46) formed under the pedestal plate(42) and a cooling line(48) formed between the cooldown pedestal plate(42) and the bellows assembly(46), wherein the spaced distance between cooldown pedestal plate(42) and the cooling line(48) is shorter than that of the spaced distance between the cooling line(48) and the bellows assembly(46). Thereby, thermal transfer efficiency from the cooldown pedestal plate(42) to the cooling line(48) is increased.
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