发明名称 |
MICROELECTRONIC PACKAGE HAVING MULTIPLE CONDUCTIVE PATHS THROUGH AN OPENING IN A SUPPORT SUBSTRATE |
摘要 |
Microelectronic packages are disclosed. A microelectronic package may include a substrate having first and second sides. Passive components may be located on the first side of the substrate. Interconnects may also be located on the first side of the substrate, and may be electrically coupled with the passive components. Microelectronic components may be located on the first side of the substrate and may be electrically coupled with interconnects. The substrate may include an opening therein. The opening may lead from the second side of the substrate toward the first side of the substrate. A plurality of conductive paths may be at least partially included in the opening. Each of the conductive paths may lead from the second side of the substrate toward the first side of the substrate to communicate electrical signals to interconnects. Methods of making the packages and electronic devices including the packages are also disclosed. |
申请公布号 |
WO2007041155(A3) |
申请公布日期 |
2007.12.13 |
申请号 |
WO2006US37646 |
申请日期 |
2006.09.26 |
申请人 |
INTEL CORPORATION;HECK, JOHN;MA, QING |
发明人 |
HECK, JOHN;MA, QING |
分类号 |
H01L23/13;H01L25/065 |
主分类号 |
H01L23/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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