| 摘要 |
The present disclosure relates to a system for processing, amplification and distribution of audio signals. In an embodiment, the system comprises: a panel or housing having one or more slots configured to receive one or more modular audio processor/amplifier units therein; and a connector provided in each slot for connecting the one or more modular audio processor/amplifier units upon insertion of a unit into the slot; wherein the one or more modular audio processor/amplifier units inserted into the plurality of slots are connected to a power source thereby, and to corresponding listening zones associated with each slot. |
