发明名称 Bonding wire cleaning unit and method of wire bonding using same
摘要 A wire cleaning system for cleaning wire configured to be wirebonded is provided. The wire cleaning system includes a chamber through which a wire configured to be wirebonded extends prior to the wire being wirebonded. The wire cleaning system also includes an energy source for removing contamination from the wire in the chamber prior to the wire being wirebonded.
申请公布号 US2006219754(A1) 申请公布日期 2006.10.05
申请号 US20050096140 申请日期 2005.03.31
申请人 CLAUBERG HORST;FOCIA RONALD J;BEATSON DAVID T;DURY KENNETH K 发明人 CLAUBERG HORST;FOCIA RONALD J.;BEATSON DAVID T.;DURY KENNETH K.
分类号 B23K13/08;B23K37/00 主分类号 B23K13/08
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