| 摘要 |
Provided is a polishing method with which it is possible to sufficiently remove impurities present on an object to be polished. An object to be polished that has an organic film on the surface thereof is polished using a polishing composition that contains abrasive grains, and is subsequently polished using an impurity-removing composition that contains an organic compound to eliminate impurities present on the object to be polished. The organic compound contains a surfactant and/or a water-soluble polymer. The surfactant contains a hydrophilic group and a hydrophobic group that includes a C3 or higher hydrocarbon group, and the main chain of the water-soluble polymer is hydrophobic. |
