SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

摘要

A semiconductor device includes a housing with a fragile portion. The fragile unit or portion has a resistance to a pressure or a melting point temperature that is lower than other portions of the housing. The semiconductor device further includes a plurality of semiconductor elements disposed inside the housing. Each semiconductor element includes a semiconductor element region having a first surface and a second surface opposite to the first surface. A first electrode is provided on the first surface and a second electrode is provided on the second surface.

主权项

1. A semiconductor device, comprising:
a housing including a fragile portion having a resistance to pressure that is lower than any other portion of the housing; a plurality of semiconductor elements arranged inside the housing, each semiconductor element comprising:
a semiconductor element region having a first surface and a second surface opposite to the first surface;a first electrode on the first surface; anda second electrode on the second surface; a first electrode block on a first surface side of the housing and electrically connected to each first electrode; and a second electrode block on a second surface side of the housing and electrically connected to each second electrode.