发明名称 |
SEMICONDUCTOR DEVICES INCLUDING SEALING REGIONS AND DECOUPLING CAPACITOR REGIONS |
摘要 |
Semiconductor devices may include an internal circuit, a sealing region surrounding the internal circuit, and a decoupling capacitor region in the sealing region. The decoupling capacitor region may include decoupling capacitors. Each of the decoupling capacitors may include a first capacitor metal wiring pattern connected to a high power supply line, a second capacitor metal wiring pattern spaced apart from the first capacitor metal wiring pattern and connected to a low power supply line, and a dielectric pattern between the first capacitor metal wiring pattern and the second capacitor metal wiring pattern. |
申请公布号 |
US2016240475(A1) |
申请公布日期 |
2016.08.18 |
申请号 |
US201615040201 |
申请日期 |
2016.02.10 |
申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
PARK Chul-yong;AHN Jeong-hoon |
分类号 |
H01L23/522;H01L23/00;H01L23/528;H01L23/10 |
主分类号 |
H01L23/522 |
代理机构 |
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代理人 |
|
主权项 |
1. A semiconductor device comprising:
an internal circuit; a sealing region surrounding the internal circuit; and a decoupling capacitor region in the sealing region. |
地址 |
Suwon-si KR |