| 发明名称 |
USE OF PROTECTIVE CAPS AS MASKS AT A WAFER SCALE |
| 摘要 |
Caps (156, 160) are bonded to one or both sides of a wafer (150) to overlay in plan view all or part of a microfabricated device or group of devices (152). One or more etches (164) are applied from the cap side to remove material and to separate the wafer (150) into discrete units. |
| 申请公布号 |
WO02056366(A1) |
申请公布日期 |
2002.07.18 |
| 申请号 |
WO2002AU00011 |
申请日期 |
2002.01.08 |
| 申请人 |
SILVERBROOK RESEARCH PTY. LTD.;SILVERBROOK, KIA |
发明人 |
SILVERBROOK, KIA |
| 分类号 |
H01L21/301;B29C35/08;B29C43/36;B81B7/00;B81C1/00;H01L21/48;H01L23/02;H01L23/04;(IPC1-7):H01L21/822 |
主分类号 |
H01L21/301 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
