发明名称 RESIN COMPOSITION, RESIN FILM AND ELECTRONIC COMPONENT
摘要 A resin composition which contains (A) a binder resin, (B) a compound having an acidic group or a latent acidic group, (C) an organic solvent and (D) a compound that has one atom selected from among a silicon atom, a titanium atom, an aluminum atom and a zirconium atom, while having a hydrocarbyloxy group or a hydroxy group bonded to the atom, and which is characterized in that: the compound (B) is at least one compound that is selected from the group consisting of aliphatic compounds, aromatic compounds and heterocyclic compounds; and the compound (B) are contained in an amount of 0.1-2.5 parts by weight and the compound (D) is contained in an amount of 2.2-7.0 parts by weight per 100 parts by weight of the binder resin (A).
申请公布号 WO2016133023(A1) 申请公布日期 2016.08.25
申请号 WO2016JP54177 申请日期 2016.02.12
申请人 ZEON CORPORATION 发明人 TSUTSUMI, Takashi;OSAKU, Yumi
分类号 C08L101/00;C08K5/1515;C08K5/3492;C08L45/00;C08L79/08;C08L83/04;G03F7/004;G03F7/023 主分类号 C08L101/00
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