发明名称 |
SEMICONDUCTOR PACKAGE AND APPARATUS USING THE SAME |
摘要 |
A semiconductor package is provided. The semiconductor package comprises a substrate having a top surface and a bottom surface, a first semiconductor chip having a plurality of bonding pad regions electrically connected to the substrate by a plurality of first bonding wires, a spacer tape covering the active surface of the first semiconductor chip excluding the plurality of bonding pad regions, and a second semiconductor chip mounted on the active surface of the first semiconductor chip with the spacer interposed.
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申请公布号 |
US2009057916(A1) |
申请公布日期 |
2009.03.05 |
申请号 |
US20080198731 |
申请日期 |
2008.08.26 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
YEOM KUN-DAE;PARK SANG-WOOK;LEE SUNG-KI |
分类号 |
H01L23/49 |
主分类号 |
H01L23/49 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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