| 摘要 |
A semiconductor device is provided with a semiconductor chip. A plurality of electrode pads are arranged in rows running in a first direction on a surface of the semiconductor chip. The semiconductor device is provided with a substrate bonded to the surface, solder balls formed on the substrate, and wires for connecting the solder balls respectively to the corresponding electrode pads. A first slit matching the electrode pads and running in the first direction and a second slit running in a second direction perpendicular to the first direction are provided to the substrate to divide the substrate into at least four regions.
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