| 摘要 |
Object A substrate processing apparatus is provided, which comprises a processing vessel adapted to provide a process to a substrate, an ambient atmospheric carrying chamber, and a functional module located on a carrying route of the substrate to be carried by a carrying means in the ambient atmospheric carrying chamber, wherein bad effect on the functional module due to particles and/or corrosive gases to be generated due to contact of the ambient air with the substrate after having been processed can be avoided. solution The substrate processing apparatus, adapted to provide a process, such as etching, to a wafer, comprises the processing vessel, the ambient atmospheric carrying chamber, and the functional module, such as an orienter 4. With the process to be provided, matters having potential to generate corrosive gases or the like due to contact with the ambient air are attached to the wafer. In the ambient atmospheric carrying chamber, a first air stream creating means 15 a, 15 b, 15 c is provided. In the functional module, a second air stream creating means (FFU 60 ) is installed to create a stream of cleaned air directed toward the ambient atmospheric carrying chamber 14 from the functional module 4, by taking in the ambient air from a clean room.
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