| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a small and simple structure, and having a plurality of semiconductor chips stored therein. SOLUTION: This mold resin body 6 is formed into a box shape having a bottom wall part 31 for arranging and mounting the semiconductor chips 2 and 3 thereon and a circumferential wall part 32. A lead frame is provided with a shield plate part embedded in the bottom wall part 31 and arranged under the semiconductor chips 2 and 3, internal terminal parts 19 and 21 connected to the semiconductor chips 2 and 3, and a packaging external terminal part exposed from the mold resin body 6. A plurality of shelf parts 35A and 35B are projected inside the circumferential wall part 32 of the mold resin body 6 and at respective one-side positions of the semiconductor chips to be alternately integrated with either of the side wall parts at positions shifted from each other in the longitudinal directions of both the side wall parts 33A and 33B in a facing state. On upper surfaces of the shelf parts 35A and 35B, tip parts 19a and 21a of the internal terminal parts raised through the insides of the shelf parts are exposed. A lid body covering the mold resin body 6 is formed of a conductive material. and brought into an electrical connection state to the shield plate part. COPYRIGHT: (C)2009,JPO&INPIT |
