SUBSTRATE VACUUM FORMING MOLD AND METHOD

摘要

A mold for vacuum forming a substrate includes a cavity and a vacuum inlet formed to communicate with the cavity. The vacuum inlet is formed on a sidewall surface of the cavity, and air inside the cavity at the bottom side of the substrate is suctioned through the sidewall surface. In addition, the substrate vacuum forming method seats the substrate on top of the substrate vacuum forming mold including the cavity and the vacuum inlet formed on the sidewall surface of the cavity to communicate with the cavity, and carries out suctioning through the vacuum inlet, so that air inside the cavity at the bottom side of the substrate is suctioned through the sidewall surface.