| 发明名称 | Heat dissipation of power electronics of a cooling unit | ||
| 摘要 | A cooling unit in a transport unit includes power electronics; a heat exchanger for thermally coupling a cooling agent of a central cooling system of the transport unit with air of the cooling unit to cool one or more generating devices; and a heat pipe for heat dissipation of the power electronics. At a first portion of the heat pipe, at least some of a working agent is in the liquid phase and, at a second portion of the heat pipe, at least some of the working agent is in the gas phase. In the first portion of the heat pipe, heat from the power electronics is absorbed by evaporating the working agent in the liquid phase. In the second portion of the heat pipe, heat is released to the cooling agent by condensing the working agent in the gas phase. | ||
| 申请公布号 | US9332671(B2) | 申请公布日期 | 2016.05.03 |
| 申请号 | US201313863014 | 申请日期 | 2013.04.15 |
| 申请人 | AIRBUS OPERATIONS GMBH | 发明人 | Schult Jens;Trümper Torsten |
| 分类号 | G06F1/20;H05K5/00;H05K7/20;F25D3/12;F25B7/00;F25B49/00;F28D15/00;F25B31/00;B64D13/00;B64D13/06 | 主分类号 | G06F1/20 |
| 代理机构 | Dickinson Wright PLLC | 代理人 | Dickinson Wright PLLC |
| 主权项 | 1. A cooling unit for cooling one or more heat generating devices provided on board of a means of transport, the cooling unit comprising: power electronics for providing the cooling unit with electric power, a heat exchanger for thermally coupling a cooling agent supplied by a central cooling system provided on board of the means of transport with air supplied in and/or into the cooling unit in order to cool the air by means of the cooling agent to thereby provide cooling energy in the form of cold air to the one or more heat generating devices, and a heat pipe for heat dissipation of the power electronics, wherein, at a first portion of the heat pipe, at least some of a working agent contained inside the heat pipe is in the liquid phase and, at a second portion of the heat pipe, at least some of the working agent contained inside the heat pipe is in the gas phase, wherein the first portion of the heat pipe is thermally coupled with the power electronics such that heat from the power electronics is absorbed by evaporating the working agent being in the liquid phase and wherein the second portion of the heat pipe is thermally coupled with the cooling agent such that heat is released to the cooling agent by condensing the working agent being in the gas phase. | ||
| 地址 | Hamburg DE | ||