| 发明名称 |
Magnetic Field Sensor Package |
| 摘要 |
A magnetic field sensor package according to an embodiment includes: a package body; a magnetic field sensor disposed on top of the package body and including a sensor assembly in which a displacement is generated by a magnetic field; and a conductive line formed on the package body, which is for making current to be measured flow and generating a magnetic field for displacing the sensor assembly, wherein the conductive line generates a magnetic field applied in a perpendicular direction to the sensor assembly. |
| 申请公布号 |
US2016282423(A1) |
申请公布日期 |
2016.09.29 |
| 申请号 |
US201414913558 |
申请日期 |
2014.08.21 |
| 申请人 |
LG INNOTEK CO., LTD. |
发明人 |
SEO Sang Won;SEO Jeong Gi;KIM Chul;KO Yong Jun;CHOI Wan Seop |
| 分类号 |
G01R33/06 |
主分类号 |
G01R33/06 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A magnetic field package comprising:
a package body having a space therein; a conductive line provided in the space of the package body to allow current to be measured to flow; and a magnetic field sensor provided in the package body, comprising a sensor assembly displaced by a magnetic field, and sensing the magnetic field generated by the current to be measured. |
| 地址 |
Seoul KR |
