发明名称 POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive resist composition that has a hydrophobic property during exposure, has a characteristic in which the hydrophilic property of a resist film surface becomes high during development, and forms a favorable resist pattern, and to provide a resist pattern forming method. <P>SOLUTION: This positive resist composition contains a substrate component (A) where solubility to an alkali developing solution is increased by the action of an acid, and an acid generator component (B) for generating an acid by exposure. The substrate component (A) contains a resin component (A1) having a constitutional unit (a0) including a group expressed by a general formula (a0-1). In general formula (a0-1), R<SP>2</SP>is an organic group having a methyl group, an ethyl group or a fluorine atom, -O-R<SP>2</SP>is a group dissociated by the action of an alkali developer, and a carbon atom of -C(=O)- is not directly bound to the main chain of the resin component (A1). <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010020256(A) 申请公布日期 2010.01.28
申请号 JP20080183208 申请日期 2008.07.14
申请人 TOKYO OHKA KOGYO CO LTD 发明人 HIRANO TOMOYUKI;DAZAI NAOHIRO;SHIONO HIROHISA;FURUYA SANAE
分类号 G03F7/039;C08F12/22;C08F20/26;G03F7/004;H01L21/027 主分类号 G03F7/039
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