| 摘要 |
PROBLEM TO BE SOLVED: To provide equipment where a substrate mounted with an exothermic part is arranged in a housing, and from which excellent heat dissipation performance can be obtained while deterioration of wiring efficiency in the substrate is suppressed. SOLUTION: On a surface of a substrate 13 arranged in a housing, an exothermic part 14 is mounted. On a surface of the substrate 13, a land 15 to which a terminal 14a of the part 14 is connected, a wiring pattern 16 connected to the land 15, and a wiring pattern 17 to which a relatively small amount of electric current flows are dispersed. On the substrate 13, a through hole 18 for heat dissipation is formed continuously to the land 15. Furthermore, a second through hole 19 is formed. The through hole 18 for heat dissipation comprises a via hole 18a having a sufficient size for ventilation and a plated part 20 that is provided to lead the heat generated from the exothermic part 14, from the upper surface of substrate 13 to its back side surface. COPYRIGHT: (C)2008,JPO&INPIT
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