HEAT-RESISTANT RESIN COMPOSITION, METHOD FOR MANUFACTURING HEAT-RESISTANT RESIN FILM, METHOD FOR MANUFACTURING INTERLAYER INSULATION FILM OR SURFACE PROTECTIVE FILM, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT OR SEMICONDUCTOR COMPONENT

摘要

The purpose of the present invention is to provide a heat-resistant resin composition having excellent stepped embedding properties on a support substrate. In order to achieve the aforementioned purpose, the present invention is configured as described below. Specifically, the present invention is a heat-resistant resin composition containing: as a resin (A) one or more types of resin selected from the group consisting of a polyimide, a polybenzoxazole, a polyimide precursor, and a polybenzoxazole precursor; as an organic solvent (B) an organic solvent having a boiling point of 210°C to 260°C at atmospheric pressure; and as an organic solvent (C) an organic solvent having a boiling point of 100°C to less than 210°C at atmospheric pressure; the content of the organic solvent (B) being 5% by mass to 70% by mass with respect to the entire amount of the organic solvents, and the content of the organic solvent (C) being 30% by mass to 95% by mass with respect to the entire amount of the organic solvents.