发明名称 CUTTING METHOD AND DEVICE, AND SUBSTRATE CUT BY THE CUTTING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a cutting method capable of improving cutting speed and cutting quality during execution of various cutting procedures. SOLUTION: The cutting method and a cutting device can improve cutting efficiency by applying ultrasonic vibrations to a cutting tool of a machine tool such as a router machining device. An ultrasonic vibration applying means is implemented by laser beams which are applied to the cutting tool at a suitable location, to thereby apply ultrasonic vibrations to the cutting tool 12. The cutting tool 12 is implemented by an axially rotational cutting tool having cutting blades arranged at a front end and on a peripheral surface thereof. The cutting tool has laser beam applying means 3 for applying laser beams from outside the cutting tool 12 in four directions orthogonal to an axial direction of the cutting tool (so as to set central angles at 90 degrees). Thus by successively irradiating the cutting tool circumferentially in four directions by shifting irradiation starting timing at predetermined time intervals, circumferential ultrasonic vibration occurs at the cutting tool 12. Further the cutting device has a cooling air spraying means 5 arranged at a cutting portion or in the vicinity of the same, for spraying cooling air. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008044086(A) 申请公布日期 2008.02.28
申请号 JP20060223700 申请日期 2006.08.19
申请人 FUJIWARA DENSHI KOGYO:KK;LASER GIJUTSU SOGO KENKYUSHO 发明人 FUJIWARA YOSHIHARU;SHIMADA YOSHINORI;OLEG KOTIAEV;MOTOKOSHI SHINJI
分类号 B23B1/00;B23B37/00;B23C3/00;B23C9/00;B23Q11/10;B26D7/08;B26F1/16;B26F1/26;B28D5/00;H05K3/00 主分类号 B23B1/00
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