| 发明名称 | Platen for wafer polishing having diamond-ceramic composites | ||
| 摘要 | A lapping platen having a working surface and an abrasive coating on the working surface. The abrasive coating comprises a plurality of individual abrasive composites adhered to the working surface with an epoxy, the abrasive composites comprising diamond particles and a ceramic matrix. The diamond particles have an average particle size of 0.1 micrometers to 3 micrometers with no particle larger than 6 micrometers. The abrasive composites have an average particle size of 15 micrometers to 100 micrometers with no particle larger than 150 micrometers. | ||
| 申请公布号 | US9149904(B1) | 申请公布日期 | 2015.10.06 |
| 申请号 | US201414304684 | 申请日期 | 2014.06.13 |
| 申请人 | SEAGATE TECHNOLOGY LLC | 发明人 | Moudry Raymond Leroy;Baurceanu Mihaela Ruxandra;Hoehn Joel William;O'Konski Jeffrey R. |
| 分类号 | B24B37/04;B24B37/12;B24D3/28;B24D18/00 | 主分类号 | B24B37/04 |
| 代理机构 | HolzerIPLaw, PC | 代理人 | HolzerIPLaw, PC |
| 主权项 | 1. A lapping platen comprising: a working surface; and an abrasive coating comprising a plurality of individual abrasive composites adhered to the working surface with an epoxy, the abrasive composites comprising diamond particles and a ceramic matrix, wherein: the diamond particles have an average particle size of 0.1 micrometers to 3 micrometers; the diamond particles have a particle size no larger than 6 micrometers; the abrasive composites have an average particle size of 15 micrometers to 100 micrometers; and the abrasive composites have a particle size of no larger than 150 micrometers. | ||
| 地址 | Cupertino CA US | ||