| 摘要 |
PROBLEM TO BE SOLVED: To obtain a multilayer wiring board which prevents the misalignment between a via hole and a connection terminal caused during processing from affecting the shape of the connection terminal, has the connection terminals electrically connected with high density bumps enabling an IC chip pitch of approximately 130 μm with high reliability, and is extremely thin.SOLUTION: A multilayer wiring board has a multilayer wiring structure where multiple interlayer insulation resin layers and multiple wiring patterns are alternately laminated. In the multilayer wiring board, one surface of each via hole embedded in the interlayer insulation resin layer is exposed to be provided as a connection terminal. The object is achieved by manufacturing the multilayer wiring board. |
