METHODS AND DEVICES FOR MINIATURIZATION OF HIGH DENSITY WAFER BASED ELECTRONIC 3D MULTI-CHIP MODULES

摘要

Techniques for constructing a multi-chip module semiconductor device are provided herein. The techniques include placing electronic modules on a first surface and a second surface, with electrical connections for the electronic modules being proximate to respectively mounted surfaces, disposing a mold material on one of the mounting surfaces to substantially surround corresponding electronic modules, orienting the mounting surface without the mold material disposed thereon, relative to the mounting surface with the mold material disposed thereon to cause the mold material to substantially surround each electronic module while maintaining a minimum distance between the electronic modules mounted on each mounting surface. The techniques further include removing the mounting surfaces from the mold compound to yield a multi-chip semiconductor device.

主权项

1. A method of forming a semiconductor device, comprising:
placing at least one electronic module on a first mounting surface whereby one or more electrical connections of each electronic module are proximate the first mounting surface; placing at least one additional electronic module on a second mounting surface whereby one or more electrical connections of each additional electronic module are proximate the second mounting surface; disposing a mold material on the first mounting surface to substantially surround each electronic module placed on the first mounting surface; orienting the second mounting surface, including each additional electronic module, relative to the first mounting surface and the mold material to cause the mold material to substantially surround each additional electronic module while maintaining a predetermined distance between each additional electronic module placed on the second mounting surface and each electronic module placed on the first mounting surface; and removing the first mounting surface and the second mounting surface from the mold material to yield the semiconductor device.